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Power, Thermal, Noise, and Signal Integrity Issues on Substrate/Interconnects Entanglement

By: Yue Ma Christian Gontrand (Author)

Ksh 7,940.00
Format :

Format(s): DRM PDF

ISBN-13: 9780429680076

Publisher: CRC Press

Imprint: CRC Press

Publication Date: March 8th, 2019

Language: English

Pages: 226

Physical Edition EAN: 9780367023430

Category: Circuits & components , Computer networking & communications

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  • Description

  • Author Bio

As demand for on-chip functionalities and requirements for low power operation continue to increase as a result of the emergence in mobile, wearable and internet-of-things (IoT) products, 3D/2.5D have been identified as an inevitable path moving forward. As circuits become more and more complex, especially three-dimensional ones, new insights have to be developed in many domains, including electrical, thermal, noise, interconnects, and parasites. It is the entanglement of such domains that begins the very key challenge as we enter in 3D nano-electronics. This book aims to develop this new paradigm, going to a synthesis beginning between many technical aspects.

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